Cov roj etching feem ntau siv rau hauv kev etching qhuav yog dab tsi?

Kev siv tshuab etching qhuav yog ib qho ntawm cov txheej txheem tseem ceeb. Cov roj etching qhuav yog cov khoom siv tseem ceeb hauv kev tsim khoom semiconductor thiab yog qhov chaw tseem ceeb rau cov roj etching plasma. Nws cov kev ua tau zoo cuam tshuam ncaj qha rau qhov zoo thiab kev ua tau zoo ntawm cov khoom kawg. Tsab xov xwm no feem ntau qhia txog cov roj etching uas siv ntau hauv cov txheej txheem etching qhuav.

Cov pa roj uas muaj fluorine: xws licarbon tetrafluoride (CF4), hexafluoroethane (C2F6), trifluoromethane (CHF3) thiab perfluoropropane (C3F8). Cov pa roj no tuaj yeem tsim cov fluorides uas tsis muaj zog thaum khawb silicon thiab cov tshuaj silicon, yog li ua tiav kev tshem tawm cov khoom.

Cov pa roj uas muaj chlorine: xws li chlorine (Cl2),boron trichloride (BCl3)thiab silicon tetrachloride (SiCl4). Cov pa roj chlorine tuaj yeem muab cov chloride ions thaum lub sijhawm etching, uas pab txhim kho qhov nrawm etching thiab kev xaiv.

Cov pa roj uas muaj Bromine: xws li bromine (Br2) thiab bromine iodide (IBr). Cov pa roj uas muaj Bromine tuaj yeem ua rau muaj kev ua haujlwm zoo dua hauv qee cov txheej txheem etching, tshwj xeeb tshaj yog thaum etching cov ntaub ntawv tawv xws li silicon carbide.

Cov pa roj uas muaj nitrogen thiab cov pa oxygen: xws li nitrogen trifluoride (NF3) thiab oxygen (O2). Cov pa roj no feem ntau yog siv los kho cov xwm txheej ntawm cov tshuaj tiv thaiv hauv cov txheej txheem etching kom txhim kho qhov kev xaiv thiab kev coj ntawm etching.

Cov pa roj no ua tiav qhov etching ntawm qhov chaw ntawm cov khoom siv los ntawm kev sib xyaw ua ke ntawm lub cev sputtering thiab cov tshuaj lom neeg thaum lub sijhawm plasma etching. Kev xaiv cov pa roj etching nyob ntawm hom khoom siv uas yuav tsum tau etched, qhov kev xaiv ntawm qhov etching, thiab qhov nrawm etching xav tau.